At TeraView we consider TPI™ to be the next significant unique imaging diagnostic modality, which offers unique measurement and sampling advantages over existing imaging technologies such as X-Ray, CT, PET, Ultrasound and MRI.
TPI™ is an ideal solution for providing 3D imaging of the inside of an integrated circuit device. TPI™ yields significant advantages over existing techniques such as X-ray analysis, which provides only 2D images and can damage the semiconductor in the device, and other techniques such as ultrasound which provides limited resolution and can be difficult to implement.
| Top surface |
|
External pins = 1mm depth |
 |
|
 |
| Transistor = 3mm depth |
|
Pads on bottom surface = 4mm |
 |
|
 |
3D TPI™ images of different layers at different depths within an integrated circuit device. |
